Drilling Speed Control
the base material is soft, the number of stacked boards for drilling should be less, and a suitable slow drilling speed can ensure consistent quality.

Printed solder mask
After the high-frequency board is etched, do not use a roller brush to grind the board before printing the green oil for the solder mask,  and avoid damaging the substrate. We proposed to use chemical methods for surface treatment. After printing the solder mask, the circuit and the copper surface are uniforms, and there is no oxide layer.

Hot air leveling
According to the inherent features of fluororesin, rapid heating on high-frequency PCBs should be avoided. Preheat treatment at 150°C for about 30 minutes, then spray the tin immediately. The temperature of the tin cylinder should not exceed 245°C. Otherwise, the adhesion of the isolated pad will be affected.

Milling shape
Fluorine resin is soft, and ordinary milling cutters have many burrs and are not flat. It is necessary to use suitable special milling cutters.

Storage direction
 PCBs cannot be placed vertically,  Do not touch the circuit graphics on the board. The whole process prevents scratches and scratches. Scratches, pinholes, indentations, and pits on the line will affect signal transmission.

Etching standard
Strictly control side erosion, sawtooth, notch, line width tolerance is strictly controlled + 0.02mm.

Chemical immersion
 The pretreatment of chemical immersion copper is a difficult and key step in manufacturing high-frequency PCBs. The plasma (plasma) and chemical methods are the most efficient methods.