Engineer Capability

Classic Manufacturing Process - PCB Assembly

Warehouse/Components
Incoming Material Inspection
Parts Storage
Material Kit
SMT/DIP
SMT
manual insert (1)
DIP
Solder Wave
Testing
cof
ICT/FCT
Coating
Conformal Coating
Aging Test
Packaging/Logistics
Outgoing Quality Control
Packaging
Logisitc

Technical Capability - PCB Assembly

 

Engineer Capability - PCB

 
Items Capability
Layers 2~68L
Max. Board Thickness 10mm(394mil)
Min. WidthInner   Layer2.2mil/2.2mil
Min. WidthOuter Layer2.5/2.5mil
RegistrationSame   Core±25um
RegistrationLayer to Layer±5mil
Max. Copper Thickness 6Oz
Min. Drill Hole DlameterMechanical≥0.15mm(6mil)
Min. Drill Hole DlameterLaser0.1mm(4mil)
Max. Size (Finish Size)Line-card850mmX570mm
Max. Size (Finish Size)Backplane1250mmX570mm
Aspect Ratio (Finish Hole)Line-card20:1
Aspect Ratio (Finish Hole)Backplane25:1
MaterialFR4EM827, 370HR, S1000-2, IT180A, EM825, IT158,   S1000 / S1155, R1566W, EM285, TU862HF
MaterialHigh SpeedMegtron6, Megtron4, Megtron7,TU872SLK,   FR408HR,N4000-13 Series,MW4000,MW2000,TU933
MaterialHigh FrequencyRo3003, Ro3006, Ro4350B, Ro4360G2, Ro4835,   CLTE, Genclad, RF35, FastRise27
MaterialOthersPolyimide, Tk, LCP, BT, C-ply, Fradflex, Omega   , ZBC2000,
Surface Finish HASK, ENIG, Immersion Tin, OSP, Immersion   Silve, Gold Finger, Electroplating Hard Gold/Soft Gold, Selective OSP,ENEPIG