| Items | | Capability |
| Layers | | 2~68L |
| Max. Board Thickness | | 10mm（394mil） |
| Min. Width | Inner Layer | 2.2mil/2.2mil |
| Min. Width | Outer Layer | 2.5/2.5mil |
| Registration | Same Core | ±25um |
| Registration | Layer to Layer | ±5mil |
| Max. Copper Thickness | | 6Oz |
| Min. Drill Hole Dlameter | Mechanical | ≥0.15mm(6mil) |
| Min. Drill Hole Dlameter | Laser | 0.1mm（4mil） |
| Max. Size (Finish Size) | Line-card | 850mmX570mm |
| Max. Size (Finish Size) | Backplane | 1250mmX570mm |
| Aspect Ratio (Finish Hole) | Line-card | 20:1 |
| Aspect Ratio (Finish Hole) | Backplane | 25:1 |
| Material | FR4 | EM827, 370HR, S1000-2, IT180A, EM825, IT158, S1000 / S1155, R1566W, EM285, TU862HF |
| Material | High Speed | Megtron6, Megtron4, Megtron7,TU872SLK, FR408HR,N4000-13 Series,MW4000,MW2000,TU933 |
| Material | High Frequency | Ro3003, Ro3006, Ro4350B, Ro4360G2, Ro4835, CLTE, Genclad, RF35, FastRise27 |
| Material | Others | Polyimide, Tk, LCP, BT, C-ply, Fradflex, Omega , ZBC2000, |
| Surface Finish | | HASK, ENIG, Immersion Tin, OSP, Immersion Silve, Gold Finger, Electroplating Hard Gold/Soft Gold, Selective OSP，ENEPIG |
